The TG100D is truly an innovation in simplicity. Select units directly from inches/mm key, then, select steel, aluminum, cast iron or plastic from the direct access keypad and Zero.
The high speed, fully sunlight readable, back-lit display offers a full Quarter VGA resolution. The resolution of the display will appear to approach analog.
NDT Systems provides the most capable bond testers in the market for composite inspection on sandwich construction, laminates, multi-layered bonded structures, adhesively bonded fittings, highly attenuating materials and any construction that needs a high penetrating power. Bond testing C-scan imaging capability is now a reality with the new BondHub system.
The power of an image cannot be understated and can significantly speed up an inspection and help with interpretation. The archived image is also a valuable asset for quality assurance. The Raptor Imaging Flaw detector uses conventional ultrasonic probes and is compatible with a range of manual and automatic scanners to create full-field C-scan images. The standard software can define the scan area, index resolution and speed and displays the resulting images live, as they are generated.
Measuring the wall thickness of automotive cylinder bores, head ports and other components can be important for quality control in manufacturing or in a boring process where a minimum thickness must be maintained. Cast aluminum or steel engine blocks can be difficult to inspect with complex geometry and limited access. Ultrasonic thickness gauging allows for these measurements to be made. With dedicated probes that are contoured to the shape of the cylinder or pencil probes to access tight spaces, thickness measurements can be made with confidence.
NDT Systems Inc is world renowned for manufacturing the widest range of high-quality ultrasonic and bond testing transducers. We manufacture standard and customized transducers compatible with almost any instrument on the market. Our complete range includes single and dual element contact, delay line, angle beam, immersion, pencil probes, bubblers and squirters as well as a complete range of cables and test blocks. For bond testing, we offer pitch-catch, resonance and mechanical impedance (MIA) probes. We can also engineer custom transducers on request.